Intellectual Properties Collection

IP, Reports & Roadmaps | Jun 14, 2011
Samsung LED Files Patent Infringement Lawsuit against Osram in Korea
On June 10, 2011, Samsung LED Co., Ltd. (“Samsung LED”) filed a patent infringement lawsuit against Osram Korea Co., Ltd. (“Osram Korea”) and two other defendants at the Seoul Central District Court requesting an injunction from unauthorized use of Samsung LED’s valuable intellectual property and money damages. The defendants include Osram Korea and two companies that sell Osram’s products in Korea, Barun Electronics and Dabo Industrial System. Read more »
IP, Reports & Roadmaps | Jun 14, 2011
Osram Relaxed about Samsungs Counter Claims in Korea
Osram had not seen Samsung’s complaint yet and did not know its specific content which has been issued in Korea. According to a spokesperson, Osram is well prepared regarding possible steps by Samsung and is therefore relaxed about the move by the counter claimant. Osram regards Samsung’s move as a typical counter attack of a defendant. Anticipating this move Osram had analyzed Samsung’s patent portfolio thoroughly before taking any legal actions and concluded that none of Samsung’s IP will cause a problem for any of OSRAM’s products. Read more »
IP, Reports & Roadmaps | Jun 11, 2011
Philips Welcomes Cooper Industries as Licensee for LED Luminaire Program
Eindhoven, The Netherlands – Philips (NYSE:PHG, AEX:PHI) announced today that they entered into a patent license agreement with Cooper Industries. The license provides Cooper with full access to the Philips’ LED-related patented technologies that Philips makes available to the lighting industry through its LED Luminaire and Retrofit Bulb licensing program. Read more »
IP, Reports & Roadmaps | May 06, 2011
Samsung and Evident Technologies Enter into LED Patent Agreement
Evident Technologies Corporation and Samsung Electronics Co., Ltd have entered into a comprehensive patent licensing and purchasing agreement for Evident?s quantum dot LED technology. This agreement grants Samsung worldwide access to Evident?s patent portfolio for all products related to quantum dot LEDs from manufacture of the quantum dot nanomaterials to final LED production. Read more »
IP, Reports & Roadmaps | Apr 04, 2011
Cree and Osram Sign Comprehensive Patent Cross License Agreement
Cree, Inc. and Osram GmbH announce the signing of a comprehensive, worldwide patent cross-license agreement. The agreement underscores each company’s commitment to speeding the adoption of LED lighting while respecting the value and importance of each company’s intellectual property. The cross-license agreement covers patents from both parties in the fields of blue LED chip technology, white LEDs and phosphors, packaging, LED luminaires and lamps, and LED lighting control systems. Read more »
IP, Reports & Roadmaps | Jan 21, 2011
Power Integrations Awarded Double Damages in Patent-Infringement Case Against Fairchild Semiconductor
Power Integrations today announced that a federal district court has doubled the financial damages awarded to the company in its patent-infringement case against Fairchild Semiconductor. This action follows an earlier ruling in which the Court found that Fairchild's infringement of Power Integrations' patents was willful. Following the increase, the total damage award now stands at approximately $12 million. Read more »
IP, Reports & Roadmaps | Nov 17, 2010
Intematix and Tridonic Consortium Announce Agreement on BOSE Phosphor Patents for LEDs
Intematix, a leading U.S. manufacturer of LED phosphors, and Tridonic, a leading manufacturer of lighting components and part of the Zumtobel Group of Austria, today announced a comprehensive licensing agreement governing silicate patents for LEDs. The patents control the use of LED phosphor materials and the application of the phosphors in LEDs. The BOSE patents are held by a consortium of four companies: Tridonic, Toyoda Gosei, Leuchtstoffwerk Breitungen and Litec GbR. Read more »
IP, Reports & Roadmaps | Nov 12, 2010
Luminus Devices Awarded 50th U.S. Patent For ‘Big-Chip’ LEDs
Luminus Devices, developer and manufacturer of ‘big-chip’ PhlatLight® LEDs, today announced that the United States Patent and Trademark Office (USPTO) recently awarded the company its 50th patent. Having pioneered big-chip LED technology, Luminus has aggressively filed intellectual property (IP) for protection of big chip LED devices, packages and systems. In addition, the company has also been granted 13 non-U.S. issued patents in China, Korea and Taiwan that extend big-chip LED protection into those countries. Read more »
IP, Reports & Roadmaps | Oct 12, 2010
Citizen Electronics and Once Innovations Sign License Agreement
Once Innovations, Inc. and Citizen Electronics Co., Ltd. have entered into a license agreement designed to accelerate growth of LED general lighting markets. The agreement gives Citizen access to part of the Once IP portfolio related to AC LED conditioning technologies and color temperature shift control for dimmable AC LED lighting. Read more »
IP, Reports & Roadmaps | Oct 08, 2010
Kyma Acquires Select Assets and IP Rights from Fox Group
Kyma Technologies, Inc., a leading supplier of ultra-high purity crystalline gallium nitride (GaN) and aluminum nitride (AlN) materials and related products and services, is pleased to announce that Kyma has acquired from The Fox Group certain assets and intellectual property rights. Read more »
IP, Reports & Roadmaps | Sep 09, 2010
Nichia Files 4 Provisional Injunction Actions Against a Seller of LED Light Bulbs
Nichia Corporation announced today that it had filed four provisional injunction actions in Tokyo District Court to enjoin Tsannkuen Japan (Sankun Nihon Denki Kabushiki Kaisha) from infringing Nichia's patent. Nichia believes white LEDs used in certain LED light bulb products of Tsannkuen Japan, sold by G.K. Seiyu and K.K. Yamada Denki, infringe Nichia's white LED patents (No. 3724498, No. 3995011, No. 4109297, No. 4530094), and have come to file the provisional injunction actions in Tokyo District court. The patent is one of Nichia's patents concerning the technology of combining phosphor with blue LED, and is employed in many white LED products that combine phosphor with blue LED. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
Programmable driving method for light emitting diode
Programmable driving method for light emitting diode A programmable driving method for light emitting diode is disclosed, which is capable of providing a programmable multi-phase segment and a corresponding programmable multi-phase actuating signal to an LED with respect to user specification, such that an optimal driving sequence can be provided to the LED according to the requirements of the manufacturing process of a LED display and thus enabling the performance of the gray levels displayed by the LED display to be optimized. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
Light emitting diode package having multiple molding resins
Light emitting diode package having multiple molding resins Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
Organic light emitting diode (oled) having improved stability, luminance, and efficiency
Organic light emitting diode (oled) having improved stability, luminance, and efficiency An organic light emitting diode (OLED) includes a relatively thin diamnond-like carbon (DLC) layer disposed between the anode and the hole transport layer to improve luminous efficiency and operating life time. The relatively thin DLC layer inhibits hole injection, which balances charge flow and improves efficiency, and increases the surface smoothness of the anode, which contributes to the increased operating life time. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
Thin gallium nitride light emitting diode device
Thin gallium nitride light emitting diode device Disclosed is a light emitting diode (LED) device that comprises a crystal structure of a sapphire substrate-free gallium nitride (GaN) LED, wherein the crystal structure is mounted on a first surface of a sub-mount substrate in the form of a unit chip, and the first surface of the sub-mount substrate has a surface area greater than the surface area of a region in which the unit chip is bonded. Preforms for manufacturing the LED device and a method for manufacturing the LED device are also disclosed. The sapphire substrate, on which the crystal structure of the light emitting diode has grown, is processed into a unit chip before being removed. Thus, any crack in the crystal structure of the light emitting diode that may occur during the removal of the sapphire substrate can be prevented. Therefore, a thin light emitting diode device can be manufactured in a mass production system. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
LED lighting system
LED lighting system Method and system are disclosed for compensating for color variations due to thermal differences in LED based lighting systems. The method and system involves characterizing the LEDs to determine what PWM (pulse-width modulation) is needed at various operating temperatures to achieve a desired resultant color. The characterization data is then stored in the microprocessor either in the form of a correction factor or as actual data. When an operating temperature that is different from a calibration temperature is detected, the characterization data is used to adjust the PWM of the LEDs to restore the LEDs to the desired resultant color. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
High output light emitting diode and method for fabricating the same
High output light emitting diode and method for fabricating the same A high output light emitting diode (LED) and a method for fabricating the LED is disclosed. The LED includes a sidewall or surface that is inclined. A reflective film is formed on the inclined sidewall or surface to allow light to reflect from the reflective film and to emit the light upward or in a favorable direction with respect to the device, thereby being configured and enabled to improve a light output of the LED and dispense with an additional passivation process. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
Semiconductor light emitting diode having textured structure and method of manufacturing the same
Semiconductor light emitting diode having textured structure and method of manufacturing the same A semiconductor light emitting diode having a textured structure and a method of manufacturing the semiconductor light emitting diode are provided. The method includes forming a first semiconductor layer on a substrate; forming a textured structured first semiconductor layer by penetrating a material of a material layer into the first semiconductor layer after the material layer is formed on the first semiconductor layer and annealed; and forming a second semiconductor layer on the first semiconductor layer. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
Method of making a vertical light emitting diode
Method of making a vertical light emitting diode Methods are disclosed for forming a vertical semiconductor light emitting diode (VLED) device having an active layer between an n-doped layer and a p-doped layer; and securing a plurality of balls on a surface of the n-doped layer of the VLED device. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
Side view led package having lead frame structure designed to improve resin flow
Side view led package having lead frame structure designed to improve resin flow The invention relates to a side view LED package in use with an LCD backlight unit. The side view LED package comprises: an LED chip; and a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof. The LED chip is mounted on a surface of the lead frame. An integral package body is made of resin, and includes a hollow front half having a cavity for housing the LED chip and a solid rear half divided from the front half by the lead frame. The toothed structure of the lead frame structure can improve resin flow in order to ensure stability even if the LED package is made extremely thin. Read more »
IP, Reports & Roadmaps | Aug 03, 2010
LED driver
LED driver A light emitting diode (LED) driver to drive an LED, including a current adjusting unit to adjust magnitude of a current flowing on the LED by supplying power from a power supply device to the LED and cutting off the power. A modulation control unit is provided to modulate a waveform of the current flowing on the LED by controlling the adjustment operation of the current adjusting unit. A constant current offset unit to control the adjustment operation of the current adjusting unit is provided so that the current flowing on the LED is higher or equal to a predetermined value as the waveform thereof is modulated. Thus, provided is an LED driver having improved power consumption efficiency. Read more »
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