Intellectual Properties
IP, Reports & Roadmaps
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Apr 29, 2017
Light emitting diode package
Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap a portion of the first region, the second region defining a molding material filling cavity; one or more LED chips mounted on the first region of the first package; a second package formed under the second region of the first package, the second package being insulated by the first region and an insulating member so as to serve as a second electrode; conductive wire for electrically connecting the LED chips and the second package; and a molding material filled inside the second region of the first package so as to protect the LED chips and the conductive wire. The first and second packages are formed of aluminum.
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IP, Reports & Roadmaps
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Apr 29, 2017
Light Emitting Diode Light Source with Heat Transfer Means
High brightness LEDs are mounted directly on a heat pipe or are mounted on a substrate, which is mounted on the heat pipe. The heat pipe can be a common electrode for the LEDs mounted on the heat pipe. Multiple heat pipes can be arranged so that the LED arrays form a light recycling cavity to emit and reflect light.
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IP, Reports & Roadmaps
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Apr 29, 2017
Ledzworld Signs Patent License Agreement with Cree
Cree, Inc. announced on Monday December 19 that it has granted five innovative LED lighting manufacturers licenses to select Cree patents through its recently launched remote phosphor licensing program. By making fundamental remote phosphor patents available through license, Cree is further enabling LED lighting adoption, as Cree innovations facilitate the development of LED lights combining remote phosphor optical elements with blue LEDs.
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IP, Reports & Roadmaps
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Apr 29, 2017
Led with light transmissive heat sink
An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.
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IP, Reports & Roadmaps
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Apr 29, 2017
Led package structure and method for manufacturing the same
A LED package structure is disclosed. The LED package structure includes a substrate, a light emitting diode, a plasma chemical vapor deposition layer and a transparent material layer, wherein the substrate has a plurality of contacts. The light emitting diode is disposed on the substrate and electrically contacted to the contacts. The plasma chemical vapor deposition layer is disposed on the light emitting diode and the refractive index of the plasma chemical vapor deposition layer is smaller than that of the light emitting diode. The transparent material layer is disposed on the plasma chemical vapor deposition layer and the refractive index of the transparent material layer is smaller than that of the plasma chemical vapor deposition layer.
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IP, Reports & Roadmaps
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Apr 29, 2017
Led luminaire and arrangement comprising a luminaire body and an led operating device
The invention discloses an LED luminaire, in the case of which an LED module is applied to the luminaire body such that the height of the luminaire body and the LED module is ≦8 mm and the luminaire body at least partially forms the heat sink for the LED module. In this case, LED modules having power ratings of ≧3 watts are used. LED operating devices can be used for voltage supply purposes which form an outer face section of an arrangement comprising a luminaire body and an LED operating device, the total height of the luminaire body and LED operating device being ≦10 mm, and the LED operating device preferably being cooled via the luminaire body.
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IP, Reports & Roadmaps
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Apr 29, 2017
LED lighting system
Method and system are disclosed for compensating for color variations due to thermal differences in LED based lighting systems. The method and system involves characterizing the LEDs to determine what PWM (pulse-width modulation) is needed at various operating temperatures to achieve a desired resultant color. The characterization data is then stored in the microprocessor either in the form of a correction factor or as actual data. When an operating temperature that is different from a calibration temperature is detected, the characterization data is used to adjust the PWM of the LEDs to restore the LEDs to the desired resultant color.
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IP, Reports & Roadmaps
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Apr 29, 2017
LED Lighting Fixtures Receives First Patent
Morrisville, NC, May 11, 2007 - LED Lighting Fixtures, Inc. (LLF) today announced that the U.S. Patent Office has issued LLF’s first patent # 7,213,940. The ‘940 patent titled Lighting Device and Lighting Method, covers a unique approach for LEDs to create white light. The LED industry typically produces white light by either coating true blue LEDs with a YAG phosphor or combining red, green and blue LEDs. LLF uses a new and distinctive approach described in the ‘940 patent to deliver the high efficacy and excellent color quality found in all of LLF’s products.
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IP, Reports & Roadmaps
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Apr 29, 2017
LED driver
A light emitting diode (LED) driver to drive an LED, including a current adjusting unit to adjust magnitude of a current flowing on the LED by supplying power from a power supply device to the LED and cutting off the power. A modulation control unit is provided to modulate a waveform of the current flowing on the LED by controlling the adjustment operation of the current adjusting unit. A constant current offset unit to control the adjustment operation of the current adjusting unit is provided so that the current flowing on the LED is higher or equal to a predetermined value as the waveform thereof is modulated. Thus, provided is an LED driver having improved power consumption efficiency.
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IP, Reports & Roadmaps
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Apr 29, 2017
LED drive circuit having temperature compensation
A LED driver circuit is provided for controlling the brightness of a LED. A control circuit is used for generating a LED current in accordance with a resistor. The control circuit is further coupled to detect a LED voltage for adjusting the LED current in reference to the LED voltage. The value of the LED voltage is correlated to the LED temperature. Therefore, the LED current is then programmed in accordance with the LED temperature.
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IP, Reports & Roadmaps
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Apr 29, 2017
Kyma Acquires Select Assets and IP Rights from Fox Group
Kyma Technologies, Inc., a leading supplier of ultra-high purity crystalline gallium nitride (GaN) and aluminum nitride (AlN) materials and related products and services, is pleased to announce that Kyma has acquired from The Fox Group certain assets and intellectual property rights.
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IP, Reports & Roadmaps
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Apr 29, 2017
Korean Court Finds Seoul Semiconductor Liable for Defamation
Nichia Corporation announced today that the Seoul Central District Court rendered a decision that Seoul Semiconductor Co., Ltd. is liable for defamation, and ordered Seoul Semiconductor to pay Nichia a damages amount of KRW 10,000,000, as well as take appropriate corrective measures to restore Nichia’s reputation.
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IP, Reports & Roadmaps
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Apr 29, 2017
Judge Chesney Denies Fees for "Side View LED Design Patent Infringement" to Nichia
In the side view LED design patent infringement litigation between Seoul Semiconductor Co. Ltd. (“Seoul”) and Nichia Corporation (“Nichia”), Judge Chesney of the U.S. District Court for the Northern District of California issued an "Order Denying Plaintiff's [Nichia's] Motion for Finding of Exceptional Case and Award Attorney's Fees." By the motion, Nichia sought approximately $2.5 million in fees against Seoul. In her order, Judge Chesney ruled that it "would not be appropriate" to award fees to Nichia and that the case was not exceptional.
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IP, Reports & Roadmaps
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Apr 29, 2017
ITC Investigation on Products Suspected to Infringe Professor Neumark's LED/LD Patent
The U.S. International Trade Commission (ITC) has voted to institute an investigation of certain short-wavelength light emitting diodes, laser diodes, and products containing same. The products at issue in this investigation are short-wavelength (e.g., blue, violet) LEDs and laser diodes that are used in products such as hand-held mobile devices, instrument panels, billboards, traffic lights, HD DVD players (e.g., Blu-ray disc players), and data storage devices. 30 companies are affected by the investigation.
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IP, Reports & Roadmaps
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Apr 29, 2017
ITC Denies Epistar`s Motion to Stay Exclusion Order in Investigation Initiated by Philips Lumileds
The United States International Trade Commission (ITC) has denied Epistar`s motion to stay the ITC`s Exclusion Order barring importation of Epistar`s OMA, MB and GB LEDs. After the ITC ruled that Epistar`s current AlInGaP LEDs infringe Philips Lumileds` patent rights and issued an exclusion order banning importation of those LEDs, Epistar filed motions before both the ITC and the U.S. Court of Appeals for the Federal Circuit to stay enforcement of the exclusion order. The ITC has denied Epistar`s motion.
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IP, Reports & Roadmaps
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Apr 29, 2017
ITC adopts initial determination of infringement by Epistar’s MB LEDs and agrees to consider whether OMA and GB LEDs infringe as well
San Jose, CA — Administrative Law Judge (“ALJ”) Sydney Harris’ recommendation last month for the exclusion of Epistar’s metal bond (“MB”) products will stand according to a new, favorable ruling issued by the United States International Trade Commission (“ITC”) this week in Philips Lumileds’ patent infringement case against Epistar.
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News-Spot | IP, Reports & Roadmaps
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Apr 29, 2017
IST Obtains Further UK LED & OLED Driver Patent to Improve Efficiency and Reduce Ripple Current Through SSL Loads
Integrated System Technologies (IST) Ltd announced today the issuing by the UK Patent Office of its patent that covers power supply technologies for the rapidly expanding LED and OLED lighting sector.
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IP, Reports & Roadmaps
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Apr 29, 2017
IQE Subsidiary NanoGaN Acquired Two Separate Patents for Nanocolumn Technology
IP, Reports & Roadmaps
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Apr 29, 2017
Intematix Awarded Sixth Patent for Remote Phosphor LED Lighting Designs
Intematix Corporation, a leading innovator of patented phosphor materials and components for high-quality LED lighting, has been awarded a sixth remote phosphor patent by the U.S. Patent and Trademark Office. Intematix’s new patent will help designers develop a new generation of high-efficiency LED lighting fixtures. This latest patent marks the fourth remote phosphor patent Intematix has received this year. The company, which is a leader in the commercialization of remote phosphor technology, has another 85 remote phosphor patents pending worldwide in addition to the six issued U.S. patents.
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IP, Reports & Roadmaps
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Apr 29, 2017
Intematix and Tridonic Consortium Announce Agreement on BOSE Phosphor Patents for LEDs
Intematix, a leading U.S. manufacturer of LED phosphors, and Tridonic, a leading manufacturer of lighting components and part of the Zumtobel Group of Austria, today announced a comprehensive licensing agreement governing silicate patents for LEDs. The patents control the use of LED phosphor materials and the application of the phosphors in LEDs. The BOSE patents are held by a consortium of four companies: Tridonic, Toyoda Gosei, Leuchtstoffwerk Breitungen and Litec GbR.
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IP, Reports & Roadmaps
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Apr 29, 2017
Intematix Adds Latest Phosphor Patent Award to Growing IP Portfolio
Intematix Corp. a leading innovator of advanced materials solutions and provider of patent-backed merchant phosphor products for solid state lighting applications, today announced the addition of US Patent Number 7,311,858 for silicate based yellow-green phosphors to its growing intellectual property portfolio. Yellow-green phosphors are typically combined with a blue LED emitter to produce energy efficient solid state white lighting in a growing variety of applications.
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IP, Reports & Roadmaps
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Apr 29, 2017
Intelligent drive circuit for a light emitting diode (LED) light engine
A controller for controlling a light emitting diode (LED) light engine. The controller includes a temperature sensor configured to sensor temperature at the LED light engine. A current sensor senses a drive current of the LED light engine. A voltage differential sensor senses a voltage differential across LEDs of the LED light engine. A timer monitors a time of operation of the LED light engine. Further, a control device controls the drive current to the LED light engine based on the sensed temperature, the sensed drive current, the sensed voltage differential, and the monitored time of operation. Further, the control device outputs an indication of intensity degradation of an LED, and if the intensity degradation exceeds a predetermined threshold the control can output an indication of such to a user, so that the user can be apprised that the LED needs to be changed.
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IP, Reports & Roadmaps
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Apr 29, 2017
Integrating chamber cone light using LED sources
A system to provide radiant energy of selectable spectral characteristic (e.g. a selectable color combination) uses an integrating cavity to combine energy of different wavelengths from different sources. The cavity has a diffusely reflective interior surface and an aperture for allowing emission of combined radiant energy. Sources of radiant energy of different wavelengths, typically different-color LEDs, supply radiant energy into the interior of the integrating cavity. In the examples, the points of entry of the energy into the cavity typically are located so that they are not directly visible through the aperture. The cavity effectively integrates the energy of different wavelengths, so that the combined radiant energy emitted through the aperture includes the radiant energy of the various wavelengths. The apparatus also includes a control circuit coupled to the sources for establishing output intensity of radiant energy of each of the sources. Control of the intensity of emission of the sources sets the amount of each wavelength of energy in the combined output and thus determines a spectral characteristic of the radiant energy output through the aperture.
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IP, Reports & Roadmaps
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Apr 29, 2017
Integrated led chip to emit multiple colors and method of manufacturing the same
The present invention is a monolithic, multi-colored LED chip and a method for making the same. The LED chip is comprised of a substrate and a plurality of light emitting structures, each light emitting structure capable of emitting a wavelength of light unique compared to others and each structure layered on top of another structure and separated by a dielectric layer. The light emitting structures are then capable of independent or tandem activation, yielding the original colors of each section, blends of colors, and white light. The method starts with the base for such a chip and etches layers of the chip away, leaving exposed sections, to reach electrical contact layers for each light emitting structure. Electrically conductive material is then used to fill the exposed sections and is, in turn, etched away to leave contacts. An insulating material is then used to fill in the resultant areas.
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IP, Reports & Roadmaps
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Apr 29, 2017
Higher Regional Court Karlsruhe Confirms OSRAM Patents
The higher regional court Karlsruhe confirmed that Malaysian LED manufacturer Dominant is illegally using or has used OSRAM AG technology with seven patents. As the court of first instance, the regional court Mannheim already reached the same verdict regarding three of these patents on July 25, 2007. OSRAM had sued the manu-facturer on several patents and industrial properties. “The ruling of the court of appeal in Karlsruhe is an important confirmation of our intellectual property rights”, said Aldo Kamper, CEO of OSRAM Opto Semiconductors.
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IP, Reports & Roadmaps
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Apr 29, 2017
High output light emitting diode and method for fabricating the same
A high output light emitting diode (LED) and a method for fabricating the LED is disclosed. The LED includes a sidewall or surface that is inclined. A reflective film is formed on the inclined sidewall or surface to allow light to reflect from the reflective film and to emit the light upward or in a favorable direction with respect to the device, thereby being configured and enabled to improve a light output of the LED and dispense with an additional passivation process.
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IP, Reports & Roadmaps
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Apr 29, 2017
High efficiency light emitting diode (LED) with optimized photonic crystal extractor
A high efficiency, and possibly highly directional, light emitting diode (LED) with an optimized photonic crystal extractor. The LED is comprised of a substrate, a buffer layer grown on the substrate (if needed), an active layer including emitting species, one or more optical confinement layers that tailor the structure of the guided modes in the LED, and one or more diffraction gratings, wherein the diffraction gratings are two-dimensional photonic crystal extractors. The substrate may be removed and metal layers may be deposited on the buffer layer, photonic crystal and active layer, wherein the metal layers may function as a mirror, an electrical contact, and/or an efficient diffraction grating.
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IP, Reports & Roadmaps
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Apr 29, 2017
GE Lighting and Rambus Sign License Agreement to Create LED Lighting for Global Markets
Resources | Intellectual Properties | Reports | GaN-on-Si
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Apr 29, 2017
GaN-on-Silicon Substrate Patent Investigation - Knowmade & Yole See More Players on the Playground
GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Most major LED makers have a patenting activity related to GaN-on-Si technology, but so far, few have made it the core of their strategy and technology roadmap. Contrary to the LED industry, we expect GaN-on-Si to be widely adopted by Power Electronics and RF applications because of its lower cost and CMOS compatibility.
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