Thermal Management
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Jul 26, 2010
High Thermal Substrate Technology & Light Engine Module from Globetronics
CERMEQ is the latest patented high performance thermal substrate developed by Globetronics. Fundamentally, It changes how SSL (Solid State Lighting, or LEDs) are packaged from Level 1 (die level), Level 2 (module) and integrated into products.
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Jul 26, 2010
Nuventix Revolutionary Synthetic Jet Coolers Now Available for PAR-38 and MR-16 Bulbs
Nuventix unveiled two new LED cooling modules. These two products, utilizing Nuventix’ SynJet™ technology, provide high reliability, low audible noise and low power consumption cooling technology for two industry standard lighting configurations. Using the SynJet approach allows twice the light output compared to passive LED thermal management designs.
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Jul 26, 2010
NUVENTIX UNVEILS REVOLUTIONARY AIR COOLING SYNJET TECHNOLOGY
From LEDs 2007, Nuventix today formally introduced its revolutionary fanless air cooling SynJet™ technology. The patented synthetic jet cooling approach solves active thermal management problems in a completely new way, providing the most reliable, effective and flexible cooling solutions for product designers across a variety of industries, including LED lighting, telecommunications and consumer electronics. SynJet high reliability cooling solutions enable new electronic designs by allowing designers to focus on functionality, not thermals.
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Jul 26, 2010
Bergquist announces a new cost-effective thermal management material for High Brightness LED applications
Bergquist takes account to the requirements of HB-LEDs and introduces new circuit board laminate with 3.5 times better thermal performance than epoxy glass-on-aluminium alternatives. Yet most PCB shops with standard multilayer vacuum lamination equipment can process Bond-Ply TCP-1000.
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Jul 26, 2010
Thermal Interface Pads Provide Low Thermal Resistance, High Tensile Strength
MH&W International now supplies Keratherm 86/82, a high tensile strength, thermal interface material (TIM) that improves heat transfer from ICs and other components to their heat sinks, and provides durability for installation and long-term use.
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Jul 27, 2010
ATS Heat Sinks Cool DRAGONstick(R) LED Lighting Strips
NORWOOD, Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today has introduced three new heat sink solutions, the ATS-486, ATS-503 and ATS-504 for cooling OSRAM's DRAGONstick® LEDs and other linear LED lighting products.
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Oct 13, 2010
Extruded Alunit Ceramics – World Premiere of a New Thermal Management Material
CeramTec GmbH has succeeded in achieving series extrusion of exceptionally thermally conductive aluminum nitride ceramics. This process is the world's first and enables rod-shaped bodies and tube systems made of ceramic with a thermal conductivity of ≥ 170W/mK, high mechanical stability and dielectric strength.
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Nov 23, 2010
Industry's First Multidirectional Mini Blower
Providing a unique solution for customized air-flow applications, JARO's new JRB2235 series rotates at 8500 RPM's and produces a powerful 1.2 CFM of super-cooled air (with a static pressure of .122" of H2O). Operating voltage is 4.0V to 5.5VDC. The availability of single or dual unit configurations provides customers with the unique ability to select the precise direction(s) of airflow, making this the first multidirectional mini blower in the Thermal Cooling Industry.
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Mar 18, 2011
Techsil's Thixo Gel for Electronics
Techsil has launched the RTV3080 thixo gel designed for electronic applications such as engine-control units, power-steering modules and power semiconductors.
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Apr 20, 2011
Nuventix Doubles Lumen Output for PAR38 LED Bulbs
Nuventix, Inc., today unveiled a new thermal management reference design, including electronic drive, that simplifies development and significantly improves lumen output of LED bulbs for PAR38 sockets. The Nuventix SynJet cooling engine and heat sink provides lighting designers with a complete system for achieving a more than 2,000 lumen LED array that fits into the AmericanNational Standards Institute (ANSI) PAR38 form factor – more than doubling today’s lumen output for PAR38 LED bulbs. The design features Texas Instruments’ (TI) custom electronic drive control device, which enables a smaller form factor by integrating discrete components into a single integrated circuit (IC).
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Jun 24, 2011
Frigodynamics Launches Coolers with Two-Phase Heat Exchanger Designs
Frigodynamics has launched a series of coolers that will revolutionise thermal management in the LED market. The two-phase heat exchanger designs allow high levels of power dissipation with zero power consumption. The wide range of coolers we supply ensure we are also able to provide solutions where space constraints exist.
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Jul 12, 2011
SinkPAD Corporation Will Introduce Their New Cool Down Aluminum PCB Applications at the LEDshow in Las Vegas
SinkPAD Corporation’s Vice President of Marketing and Business development Sam Bhayani has announced that his company SinkPAD Corporation will be exhibiting at the LED show in Las Vegas on July 27th. The LED show and conference is on July 26th and 27th, the conference is both days while the expo is on the 27th. The LED show attracts an exclusive group of buyers from every subset of the LED lighting industry. It has a more direct approach to marketing and promoting LED products. The show is designed to encourage manufacturers and their customers to come face to face discussing their LED lighting needs and solutions. The expo is 20,000 feet of interaction between the right companies.
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Nov 11, 2011
DK Thermal Solutions Offers Formable Thermal LED PCB Solutions
A unique proposition is Formable Thermal LED PCB Solutions, made from ceramic-filled fluoropolymer composite base material for IMS-based Power LED applications.
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Nov 16, 2011
Shuoen Launches Graphite Heat Sink for MR16 LED Bulb
Shuoen, a professional graphite heat sink manufacturer in Taiwan, launches two graphite heat sinks for MR16 LED bulb with model no V304 and V402. These two new innovative LED graphite heat sinks adopted Shuoen’s patented technology of porous graphite manufacturing method. The heat sink using porous graphite provides good heat conductivity and large specific surface area to transmit and dissipate heat away from LED heat source very efficiently, and it is the best solution for high-power LED bulb.
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Nov 18, 2011
Jaro's MR-16 Coolers Utilize Aerospace Fluid-Bearing Technology
Inspired by expertise from the Aerospace Industry, Jaro's new tightly-designed MR-16 LED coolers optimize longevity and temperature with a highly-efficient fluid-bearing structure. At speeds of up to 4200RPM±15%, these very quiet DC coolers provide a chilly, yet quiet air-flow of 1.850CFM (min.: 1.573 CFM). Specifically designed for LED cooling applications, these coolers are sized at 30mm x30mm x 7mm and operate from -20°C TO +90°C.
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Dec 15, 2011
New SynJet® LED Cooling for Lumileds LUXEON S
Today, Nuventix announced the availability of a new LED cooling solution utilizing SynJet thermal management for the Philips Lumileds LUXEON S.
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Mar 08, 2012
Applied Nanotech's New CarbAl™ Promises Cost-Effective High Quality Thermal Management Solutions
With the electronics industries under constant pressure to keep temperatures under control, Applied Nanotech, a global nanotechnology leader, has unveiled an improved passive thermal management material called CarbAl™.
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Apr 16, 2012
Nuventix Launches New SynJet Coolers for LED Thermal Management at Light+Building
From Light + Building 2012, Nuventix. Inc., developer of SynJet® thermal management solutions, today announced four new additions to the company’s award-winning line of SynJet coolers for LED lights: the Wall Wash Cooler 77W, Outdoor Cooler 70W and 77W and Spotlight Cooler 57W.
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Apr 25, 2012
WLK DK – A New Thermally Conductive Adhesive
To stick electronic building parts or mechanical components safely while maintaining thermal conductivity, Fischer Elektronik announces the launch of its new, thermally conductive adhesive, WLK DK – a temperature and impact-resistant, two-component adhesive, with short pot life. It is solvent-free, and thermal conductivity is guaranteed by the aluminium oxide filling based on epoxy resin.
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May 24, 2012
Ohmite Manufacturing Announces Wakefield Solutions 19000 Series Radial-Fin Heat Sink Extrusions
Ohmite Manufacturing, a leading provider of resistors for high current, high voltage and high energy applications, announces Wakefield Solutions’ 19000 Series radial-fin heat sink extrusions for LED light engines.
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