NuSil Technology Adds Low Outgassing Thermal Interface Material to Electronics Lineup
NuSil Technology, a cutting-edge manufacturer of silicone-based materials for aerospace, electronics, photonics, and healthcare, announces the addition of EPM-2495 to its electronics lineup. EPM-2495 is a low outgassing, thermal interface silicone material designed to allow a bond line thicknesses of =50 micron to reduce thermal resistance.
NuSil’s EPM-2495 is a white, dispensable elastomer that cures in place. It is designed to adhere to integrated circuit substrates, base plates, heat sinks, or areas where grooves or other configurations require a no- to limited-flow material. EPM-2495 provides heat transfer between electrical/electronic components and their heat sinks while remaining electrically insulating. EPM-2495 uses a platinum cure system that releases no byproducts and boasts low contamination, low ionic content, and low volatility.
“Offering low outgassing characteristics under extreme operating conditions, EPM-2495 helps avoid contamination in sensitive devices,” said Brian Nash, vice president of sales and marketing.“ It is able to achieve low thermal resistance because of its specialized particle size, despite a relatively low bulk thermal conductivity value of 0.64 W/mK.”
For more information on electronic packaging materials, please visit http://www.nusil.com/electronics or contact NuSil Technology directly at 805-684-8780.
About NuSil Technology:
NuSil is a cutting-edge manufacturer of silicone compounds for healthcare, aerospace, electronics, photonics and other applications that require precise, predictable, costeffective materials performance. ISO-9001-certified since 1994, NuSil operates state-ofthe- art laboratories and processing facilities in North America and Europe and provides on-site, in-person application engineering support worldwide. More information about NuSil Technology can be found at www.nusil.com.
