Insulated Metal Substrate - DENKA HITTPLATE
DENKA HITTPLATE is an insulated metal substrate with high thermal conductivity for processing metal circuit boards (PCB´s). It consists of fine quality epoxy-resin filled with inorganic filler with high thermal conductivity. It achieves low thermal resistance equivalent to or even less than Alumina ceramics substrate.
HITTPLATE consists of three layers:
1) Copper foil
2) Thermally conductive dielectric layer made of high heat resistant epoxy, glass-epoxy, polyimide and inorganic (ceramic) filler
3) Aluminum base
Suitable applications for HITTPLATE:
• Industrial Electronics (Transistor/ IGBT-modules, rectifiers, solid state relays, AC servo motors, stepping motor drivers, Power Supplies)
• Household appliances (TV, Plasma Display Panels, Audio Power amplifiers, Air conditioner inverters, Drive controllers)
• Automotive (Igniters, Voltage regulators, Controllers, Motor Drivers)
• Communication (DC/DC converters,
• Substrates for LED
For additional information please visit DENKA Homepage or contact DENKA at dk010282@denka.co.jp, or for Germany at info@denkagermany.de, and for USA at info@denkany.com
