Thermal Management
Products, Materials + Tools
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Jul 09, 2010
Nuventix’ LED Cooling Solutions Now Available from Future Lighting Solutions
Nuventix, Inc., developer of SynJet® thermal management solutions for LED luminaires, today announced a distribution agreement making the company’s reliable LED cooling products available from LED lighting component and support services provider Future Lighting Solutions.
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Jul 19, 2010
LORD Corporation Develops Low Modulus Thermally Conductive Adhesive
LORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries – has announced the availability of a new low modulus, high thermal conductivity adhesive.
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Jul 19, 2010
CeramCool LED Lamp Kit – Pre-optimized Modules for Customer-specific LED Lamps
The CeramCool LED Lamp Kit offers a flexible way to combine pre-optimized ce-ramic modules to create highly efficient, customer-specific LED retrofit lamps.
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Jul 19, 2010
Second Generation SynJet with New Products have Lower Power Consumption and Improved Performance
Nuventix, Inc., innovator of SynJet® active thermal management solutions, will reveal next week to attendees at Light+Building 2010 the next generation of its groundbreaking active cooling technology.
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Jul 19, 2010
Heat Sinks from Fischer Elektronik Allow Excellent Thermal Management of Sharp LEDs
Although LEDs are clearly more energy efficient than light bulbs, which convert around 95% of current into heat and not into light, LEDs also waste a considerable amount of heat.
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Jul 19, 2010
Insulated Metal Substrate - DENKA HITTPLATE
DENKA HITTPLATE is an insulated metal substrate with high thermal conductivity for processing metal circuit boards (PCB´s). It consists of fine quality epoxy-resin filled with inorganic filler with high thermal conductivity. It achieves low thermal resistance equivalent to or even less than Alumina ceramics substrate.
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Jul 20, 2010
New SCB Technology Enables Optimized Thermal Management
The new stamped circuit board (SCB) technology available from Heraeus opens up a whole new concept of thermal management geared towards the realization of reliable and economic solutions in the area of thermal dissipation.
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Jul 20, 2010
Intematix Applies Phosphor and LED Module Expertise to Launch Next-Generation of Retail Signage
Intematix Corp., a leading innovator in phosphors, LED components and solid state lighting modules today announced the introduction of its proprietary, patent pending, custom signage product and service offerings.
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Jul 20, 2010
NuSil Technology Adds Low Outgassing Thermal Interface Material to Electronics Lineup
NuSil Technology, a cutting-edge manufacturer of silicone-based materials for aerospace, electronics, photonics, and healthcare, announces the addition of EPM-2495 to its electronics lineup. EPM-2495 is a low outgassing, thermal interface silicone material designed to allow a bond line thicknesses of =50 micron to reduce thermal resistance.
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Jul 20, 2010
Nextreme's OptoCooler HV14 Passes Stringent 3000g Shock Testing Standard
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced that its OptoCooler HV14 has passed the 3000g shock test as defined in the MIL-STD 883E Method 2002 Mechanical Shock standard.
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Jul 21, 2010
Silicone Materials from Dow Corning Help Electronics Keep Their Cool
The growing use of High Brightness and High Power Light – Emitting Diodes for different applications adds to the heat problem.
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Jul 21, 2010
Star-Shaped Heatsinks from Fischer Elektronik
In order to dissipate the heat from LEDs, Fischer Elektronik has developed a range of aluminium heatsinks the dimensions of which match the majority of current round housing designs.
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Jul 21, 2010
Mounting Tape Provides up to Three Times the Thermal Conductivity of Competing Tapes
MH&W International has introduced Keratherm® KL 90 highly thermally conductive, double-sided adhesive tape which provides 1.4 W/mK of thermal conductivity – nearly three times higher than other thermal tapes – for more effective heat transfer from hot components to heat sinks. The new tape’s thermal impedance is just 208°C-mm2/W (0.32°K-in2/W).
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Jul 22, 2010
New Synthetic Jet Coolers Broaden Current Offerings and Opens New Markets
From Strategies in Light 2009, Nuventix unveiled three new active cooling solutions for the solid state lighting industry: the SynJet PAR20 LED Cooler, SynJet 3-inch LED Cooler and SynJet PAR30 LED Cooler.
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Jul 22, 2010
Nextreme Ships New Optocooler HV14 High Voltage, Low Current Thermoelectric Module
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the first customer shipment of the new OptoCooler HV14 thermoelectric cooler, the first module in a new class of high voltage and high heat pumping thermoelectric coolers that operate at low currents and are optimized for standard circuitry and power requirements.
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Jul 22, 2010
Sunon Rolls Out Its LED Indoor Lighting Cooling Module Solution
Sunon's new LED indoor lighting cooling module is based on a three innovative designs which provide high cooling efficiency, long service life, low noise, and low power consumption!
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Jul 22, 2010
Silicone-Free Interface Material Provides High Thermal Conductivity
MH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices.
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Jul 22, 2010
CeramCool® Optimized for 4W Cooling
The optimized geometry allows operation of a 4W LED at a maximum temperature of 60°C and reduces the temperature at the hot-spot by 6°C resulting in a significant reduction of stress on a critical component. This means the thermal resistance of the Rubalit ceramic assembly for an identical shape is 13% better than aluminum.
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Jul 26, 2010
Celsia Introduces Next Generation Heat Sink Technology
Already credited with making vapor chambers (a once exotic heat sink technology) thin, light and affordable, Celsia Technologies (“Celsia”) today introduces its second generation NanoSpreader.
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Jul 26, 2010
KHATOD Expands Series of Heatsinks with KHS111 for AR111 LED Solutions
Khatod, the leading producer in the optoelectronic industry evolution, has promptly responded to the this requirement of the market by creating a new series of HEATSINKS. They allow an excellent dispersion of the heat produced by the Power LEDs in various applications.
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