The Global
Information Hub for
Lighting Technologies
and Design
The EVG®560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing.https://www.led-professional.com/media/products_led-production-test-equipment_ev-group-introduces-industrys-first-fully-automated-wafer-bonding-system-for-high-brightness-led-manufacturing_evg560hbl_wafer_bonder/viewhttps://www.led-professional.com/media/products_led-production-test-equipment_ev-group-introduces-industrys-first-fully-automated-wafer-bonding-system-for-high-brightness-led-manufacturing_evg560hbl_wafer_bonder/@@images/image-1200-6371252eef52e59369727cd822941410.jpeg
The EVG®560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing.
