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A flip-chip light emitting diode with high light-emitting efficiency is disclosed. The LED includes a transparent conductive layer, an oxide layer, a ...

Seoul Semiconductor (KOSDAQ: 046890), one of the ten largest LED manufacturers in the world, announced today that a Taiwan Intellectual Property Office has ...

An LED chip (2) is composed of a p-GaN layer (10), an n-GaN layer (14), and an MQW emission layer (12) that is sandwiched between the GaN layers (10 and 14). ...

Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap ...

The United States International Trade Commission (ITC) has denied Epistar`s motion to stay the ITC`s Exclusion Order barring importation of Epistar`s OMA, MB ...

Seoul Semiconductor (KOSDAQ; 046890), the eighth-largest LED manufacturer in the world, announced today that it has signed a patent cross-license agreement ...

Nichia Corporation today announced that Nichia and Cree, Inc. (Nasdaq: CREE) have entered into an agreement that expands their cross license arrangements ...

Competitive Technologies, Inc. (AMEX: CTT) announced today that it has signed a marketing and royalty sharing agreement with a Fortune 100 company to license ...

A LED package structure is disclosed. The LED package structure includes a substrate, a light emitting diode, a plasma chemical vapor deposition layer and a ...

Toyoda Gosei Co., Ltd. (“Toyoda Gosei”) and OSRAM GmbH, Germany (“OSRAM”), entered an agreement to allow the companies (including subsidiaries) to use each ...